New SMT Equipment: gold and wire and bonding (114)

TR7700QE-S - Semiconductor and Advanced Packaging Inspection

TR7700QE-S - Semiconductor and Advanced Packaging Inspection

New Equipment | Inspection

The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The

TRI - Test Research, Inc. USA

China PCBA and Electronic Contract Manufacturing Factory

China PCBA and Electronic Contract Manufacturing Factory

New Equipment | Assembly Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board 

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

Electronics Forum: gold and wire and bonding (20)

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia

Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia

Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of

Industry News: gold and wire and bonding (107)

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Technical Library: gold and wire and bonding (7)

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes.

Technical Library | 2011-03-30 21:14:33.0

The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques lik

Atotech

Mechanical stress test for component solder joints and bonding wires

Technical Library | 2016-08-24 06:15:35.0

From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.

XYZTEC bv

Videos: gold and wire and bonding (1)

Resin plug application and process

Videos

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr

Headpcb

Training Courses: gold and wire and bonding (1)

Wires and Terminals 101 Training Course

Training Courses | | | Cable and Wire Harness Assembly Training Courses

Browse training and certification programs for wire harness cable and connector assembly.

BEST IPC Training

Express Newsletter: gold and wire and bonding (884)

SMTnet Express - July 24, 2014

SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either

Partner Websites: gold and wire and bonding (926)


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