New SMT Equipment: gold ball bond flex (Page 1 of 14)

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

New Equipment | Inspection

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Electronics OEM ODM Manufacture

Electronics OEM ODM Manufacture

New Equipment |  

Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,

Tronixlink PCB PCBA

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Pick & Place

http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des

Flason Electronic Co.,limited

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Pick & Place

http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip

Flason Electronic Co.,limited

Membrane Switches

Membrane Switches

New Equipment | Inspection

Molex's membrane switches provide durable, lightweight and low-profile options for integrating user interfaces and electronic components into a variety of applications including medical, industrial and commercial products. Molex standard membrane s

Molex

Anisotropically Conductive Adhesives

Anisotropically Conductive Adhesives

New Equipment | Materials

For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and

Zymet, Inc

Universal GSM FLEX JET NOZZLE 042F 47995019

Universal GSM FLEX JET NOZZLE 042F 47995019

New Equipment | Components

http://www.flason-smt.com/product/Universal-GSM-FLEX-JET-NOZZLE-042F-47995019.html Universal GSM FLEX JET NOZZLE 042F 47995019 SMT Nozzle Universal Nozzle Universal GSM FLEX JET NOZZLE 042F 47995019 Usage:Universal pick and place machine Prod

Flason Electronic Co.,limited

Universal GSM FH 125F NOZZLE

Universal GSM FH 125F NOZZLE

New Equipment | Components

http://www.flason-smt.com/product/Universal-GSM-FH-125F-NOZZLE.html Universal GSM FH 125F NOZZLE SMT Nozzle Universal Nozzle Universal GSM FH 125F NOZZLE Usage:Universal pick and place machine Product description: Universal GSM FH 125F NOZZLE

Flason Electronic Co.,limited

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