Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22
you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
SMTnet Express, July 7, 2016, Subscribers: 25,539, Companies: 14,860, Users: 40,631 Dissolution of Metal Foils in Common Beverages Bev Christian, Nancy Wang, Mark Pritzker, Daniella Gillanders, Gyubok Baik, Weiyi Zhang, Joanna Litingtun, Brian Kim
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company Directory Calendar Career
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
