New SMT Equipment: gold embrittlement joint microsectio (1)

Gold Embrittlement Evaluation of Solder Joints

Gold Embrittlement Evaluation of Solder Joints

New Equipment | Test Services

Gold embrittlement of solder joints has been a concern for many decades.  SEM Lab, Inc. supports evaluation for this condition. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. https://s

SEM Lab, Inc.

Electronics Forum: gold embrittlement joint microsectio (60)

Re: Gold embrittlement

Electronics Forum | Thu Nov 11 18:39:06 EST 1999 | John Thorup

Assuming that you are going to solder them into a board rather than socket them, yes. The thickness of the gold plating in this application will usually make up a large enough percentage of the total joint to threaten enbrittlement. Use a small sol

Re: Gold embrittlement

Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen

The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that

Express Newsletter: gold embrittlement joint microsectio (282)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Partner Websites: gold embrittlement joint microsectio (12)

Dissolution Rate of Specific Elements in SAC305 Solder

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255

. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs

Surface Mount Technology Association (SMTA)


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