Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Wed Jul 31 18:26:09 EDT 2013 | Jeff Kennedy
You might consider to contact a lab to Run a microindenter against a know good soft gold sample. The knoop value for the soft gold will be much lower than for hard gold. This would be reflected in the diameter measurement of the indented samples.Smal
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2013-11-20 16:36:43.0
Everett Charles Technologies (ECT) announced today that the .4mm and .5mm ZIP® Z0 and Z1 performance production contacts are now available in the high-performance HyperCore™ base material.
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