| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
Are Voids in Solder Joints Really an Issue? Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
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Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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SolderTips: Soldering With Butane Soldering Irons | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
://www.indium.com/blog/intermetallics-in-soldering.php There are many articles and papers that have been presented on the whole gold plating issue since its introduction into the manufacturing process on printed circuit boards and in the plating on the component leads
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/soldertips/soldertip-45-manual-soldering-vs-wave-soldering/
footprint which has to be considered. The other issue is the cost of the solder to fill the solder pot, which is or can be substantial when starting a mass soldering process, along with the cost of the installation, such as air, power, venting etc
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
