New Equipment | Assembly Services
Layers 2-64L Plate Thiickness 0.6-10mm Minimum mechanical aperture 0.2mm Minimum laser aperture 4mil HDI Type 1+n+1、2+n+2、3+n+3 Minimum line width & spacing 4/4mil
New Equipment | Assembly Services
Layers 2-64L Plate Thiickness 0.6-10mm Minimum mechanical aperture 0.2mm Minimum laser aperture 4mil HDI Type 1+n+1、2+n+2、3+n+3 Minimum line width & spacing 4/4mil
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Industry News | 2015-03-20 05:30:21.0
A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded
Industry News | 2016-03-03 08:27:28.0
Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.
Technical Library | 2014-11-06 16:43:24.0
This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.
Technical Library | 2013-05-30 17:33:26.0
This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5
Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots
ORION Industries | http://orionindustries.com/pdfs/gappad.pdf
.250" ASTM D374 Color Gold/Pink Visual Specific Gravity 1.6 ASTM D792 Heat Capacity 1.0 J/g-K ASTM C351 Continuous Use Temp. -60° C to 200° C Hardness (Shore Type OO) Thickness 0.020" -to- 0.250" Hardness 80 -to- 40 ASTM D2240
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2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
