HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_surface_mount_techniques_SL2220.html
: 21" x 23" Max PCB Size: 22" x 24" X,Y, and Theta Micro Adjust Tooling Stage Voltage: 110V - 50/60HZ Dimensions: 60" High x 65" Wide x 48" Deep Weight
| https://jmw-inc.com/equipment-for-sale/pcb-board-handling-equipment/fifo-lifo-buffers/
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