Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef
Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
Electronics Forum | Tue Oct 30 10:54:37 EST 2001 | slthomas
Hey, Preacher, choir here. Unfortunately I didn't get to make the call here (hot boards, new product, same ol' same ol'), but I dam* well am looking for future (print) backup to assist in persuading the bottom line guys that it's cheaper to wait for
Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Fri Nov 02 12:49:33 EDT 2018 | robl
Has anyone tried producing domed joints for high voltage corona reduction on a selective solder machine? I'm guessing it probably won't work due to gravity, but worth a shout. Thanks, Rob.
Electronics Forum | shellydhami |
Sat Jul 05 14:04:31 EDT 2008
Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef
Dye & pry test reveals the solder connections that have failed prior to performimng the test.
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator
I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS
