Industry Directory: ground pad solder void (2)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer of Assembly Equipment / Soldering / OEM

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

PCB Assembly Express

PCB Assembly Express

Industry Directory | Service Provider

PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.

New SMT Equipment: ground pad solder void (30)

Convection Reflow Oven Mk7

Convection Reflow Oven Mk7

New Equipment | Reflow

Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti

Heller Industries Inc.

NC600 Lead-Free, No-Clean Solder Wire

NC600 Lead-Free, No-Clean Solder Wire

New Equipment | Solder Materials

Qualitek has developed a unique no clean flux system designed specifically for high temperature lead free alloys. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no

Qualitek International, Inc.

Electronics Forum: ground pad solder void (383)

IC void

Electronics Forum | Wed Jun 01 23:09:46 EDT 2016 | slouis2014

Hi, can anybody give an idea how to lessen the void on a double ground pad IC. I have tried to change the stencil design, change the solder reflow setting. but i still haven't reach 75% solderability. thanks alot

IC void

Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014

Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul

Industry News: ground pad solder void (88)

See Seika Machinery, Inc.'s New Advanced Machinery at SMTA International 2011

Industry News | 2011-09-21 14:09:34.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its new advanced machinery in Booth #136 at the upcoming SMTA International Conference & Exhibition

Seika Machinery, Inc.

Metcal Brings Bench Tool Rework Solutions to MD&M West

Industry News | 2014-01-13 10:59:04.0

Metcal today announced that it will exhibit in Booth #3340 at MD&M West, scheduled to take place February 11-13, 2014 at the Anaheim Convention Center in Anaheim, CA.

Metcal

Technical Library: ground pad solder void (222)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: ground pad solder void (11)

The Original Metcal's MX-500 just got Better

The Original Metcal's MX-500 just got Better

Videos

Metcal's new MX-500 Soldering and Rework System has been reimagined, adding features and a new look to a bench top icon. Built upon SmartHeat™ Technology, the new MX-500 assures extremely responsive and highly controlled heating delivering the exact

Metcal

The Original Metcal's MX-500 just got Better

The Original Metcal's MX-500 just got Better

Videos

http://www.hmcelectronics.com/product/Metcal/MX-500S The Metcal MX-500S Soldering and Rework System is the upgraded version of the MX-500-11 Series. It has added features and a new design to coincide with technological advancements in the assembly in

Metcal

Training Courses: ground pad solder void (4)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: ground pad solder void (5)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: ground pad solder void (919)

SMTnet Express - September 27, 2018

SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom

SMTnet Express - October 10, 2019

years we have studied voiding in solder joints an

Partner Websites: ground pad solder void (35)

Ball Shear Solder Ball Shear - Nordson DAGE

Nordson ASYMTEK | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=6

Ball Shear Solder Ball Shear Nordson DAGE DAGE Products Corporate Global Directory Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery

Nordson ASYMTEK

When Should A Pad Use Window-Pane Paste Mask? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10602.html

.  Let's say you use a 0.125 mm (5 mil) stencil thickness. If you have a thermal pad that has 100% paste mask coverage, there is no where for the solder to flow and the package ends up sitting on top of

PCB Libraries, Inc.


ground pad solder void searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next