Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti
New Dual Port Simultaneous Desoldering System designed for plated-through-hole component desoldering. The easy-to-grip handle allows the task to be completed quickly and comfortably. This "shop-air" hand tool, in combination with the new dual simulta
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used MPM UP2000HIE Automatic Solder Paste Printer Specification Board range : 50*50-508*406(mm) Board transmitting speed: 1524mm/second Track from the ground level: 876-1041(mm) Printing area: 457-406(mm) Printing speed: 6.35-305(mm/second) P
Industry News | 2009-03-10 13:10:18.0
TORRANCE, CA � January 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will premier Anritsu, a new 3-D High Precision Laser In-Line Solder Paste Inspection System in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2010-02-02 21:06:15.0
ORRANCE, CA — February 2010 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will highlight its Anritsu 3D Solder Paste Inspection System at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 2, 2010 at the Richardson Civic Center in Richardson, TX.
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Detailed Product Description Brand: SMC Part Name: Cylinder Part Number: J90650160C Model: CJ2R10-8.3B-KRJ Origin: China Condition: Original New J90650160C Feeder Cylinder For Samsung SM8mm Feeder 8mm feeder cylinder Deatail Information: 1,
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Metcal's new MX-500 Soldering and Rework System has been reimagined, adding features and a new look to a bench top icon. Built upon SmartHeat™ Technology, the new MX-500 assures extremely responsive and highly controlled heating delivering the exact
http://www.hmcelectronics.com/product/Metcal/MX-500S The Metcal MX-500S Soldering and Rework System is the upgraded version of the MX-500-11 Series. It has added features and a new design to coincide with technological advancements in the assembly in
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
SMTnet Express, September 11, 2014, Subscribers: 23214, Members: Companies: 14043, Users: 36809 Reliability of Reworked QFNs. Bob Wettermann; Business Electronics Soldering Technologies (BEST) Inc. Recently, the impact of leadless device
Dr Evstatin Krastev from Nordson DAGE to Present Two Ground Breaking X-ray Inspection Studies X-Ray Inspection and Test Products Corporate Global Directory
? I'm looking at power parts where some pins have skinny traces connecting to them, and others have planes. I want SMD footprints to prevent uneven solder height due to spreading during reflow. Thanks, John