Renegade Parts Washers manufactures aqueous parts washers, including automatic or manual top load, front load and pass-through conveyor systems for many industrial applications, plus solvent-free detergents for no residue buildup.
Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no
PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formulation, VIGON® A 2
Electronics Forum | Tue Mar 15 10:18:15 EDT 2011 | grahamcooper22
Hi, Does anyone have any experience of cleaning lead free solder paste residues off pcbs in a vapour degreasing process using Ensolv Ionic ? Any guide as to the best cleaning cycle would be appreciated. thanks
Electronics Forum | Tue Apr 07 18:05:40 EDT 1998 | Roxanne Picou
Looking for Cleaning solvent to claen missprinted PCB, that will be good for paste (CS) and glue (PS). One that is easy to evaporate with out leaving white powder around component leads on CS (when cleaning PS) Solder paste cleaning can be acc
The FIT-S105-PRO from JDSU is a deluxe fiber optic cleaning, inspection and testing kit containing all the essential tools for fiber handling, including a dual magnification (200/400X) video inspection probe microscope, a 1.8-inch LCD video display,
JDSU FIT-S005 Fiber Inspection Cleaning and Test Kit - Service Provider PRO, Discontinued Dual magnification FBP video probe microscope 200/400X HD3 video display Interchangeable FBPT inspection tips (7) IBC Cleaner for 1.25mm connectors I
Industry News | 2017-02-01 20:14:51.0
Seika Machinery now carries the SAWA PIBW-T100L Bubble Washer System. The system provides effective cleansing with the surface active agent-free electrolysis water and eco-friendly SAWA Pica SNW-H20 alkaline solvent.
Industry News | 2006-03-06 12:12:12.0
ZESTRON will be exhibiting at Electronica & Productronica China on March 21st - 23rd, 2006.
We supply Technical Data for the DEK Galaxy Machine Features DEK Galaxy Repeat accuracy ± 12.5 μm @ 2.0 Cpk (± 6 sigma)# Printing accuracy ± 12.5 μm @ 2.0 Cpk (± 6 sigma)# Standard cycle time 7 sec Maximum printing surface 510
We supply DEK Card Brushless Servo Drive The part number is: 198624-183732 If you need, please feel free to contact us. Thank you very much! Sophy http://www.goldlandsmt.com email@example.com we also supply the below parts： DEK VISIO
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. VIGON® EFM is a mixture of halogen-free, organic solvents. It dries fast and residue-free. VIGON® EFM is non-corrosive and co
Based on its MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder ovens. It reliably removes re-condensed fluxes and emissions from assemblies. It is also recommended for
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
The Call for Halogen-Free Electronic Assemblies News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising The Call for Halogen-Free Electronic Assemblies But exactly what is a "halogen-free" solder paste
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials A Review of Test Methods and Classifications for Halogen-Free Soldering Materials Over the last few years, there has been an increase in the evaluation and use
Halogen-free Flame Retardants - Exolit® - Clariant Buscar Compartir Región Contacto Cerrar Cerrar Buscar If you are searching for Safety Data Sheets, please visit our Document Finder Todos los resultados Cerrar Facebook Twitter LinkedIn Correo
Specialty Cleaning Wave Soldering Closed-loop Process Control Fluxing Applications Lead-free soldering Nitrogen tunnel soldering Top Side Hole Filling Wave Soldering SMT Reflow Soldering Thermal Curing