Industry Directory | Manufacturer
Beijing Hanson Electronic Co., ltd, established in 2001 is located in Beijing Shangdi High Technology Area and covers 1000㎡. Being a high-tech enterprise, Hanson is devoted to design, manufacture and
Industry Directory | Manufacturer
PCB water cleaning system, fume extractor, air cleaner ,electronic dry cabinet, selective soldering system
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 Yuehang: Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply： New+original+factory sealed+high quality
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 Yuehang: Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply： New+original+factory sealed+high quality
Electronics Forum | Wed Aug 07 10:47:02 EDT 2002 | hanson
would you like to tell me about COB Process ?TKS
Electronics Forum | Wed Feb 04 21:06:07 EST 2009 | shan
I'm looking for test labs in Taiwan that are capable of performing ionic contamination testing on small to medium sized SMT boards. I'm interested in both ion chromatography and ROSE test methodologies. Is anyone aware of any labs performing contami
Industry News | 2013-07-24 16:39:34.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Industry News | 2013-07-24 22:01:53.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Technical Library | 2023-05-22 17:46:29.0
Over the past several years, much research has been performed and published on the benefits of stencil nano-coatings and solvent under wipes. The process improvements are evident and well-documented in terms of higher print and end-of-line yields, in improved print volume repeatability, in extended under wipe intervals, and in photographs of the stencil's PCB-seating surface under both white and UV light. But quantifying the benefits using automated Solder Paste Inspection (SPI) methods has been elusive at best. SPI results using these process enhancements typically reveal slightly lower paste transfer efficiencies and less variation in print volumes to indicate crisper print definition. However, the improvements in volume data do not fully account for the overall improvements noted elsewhere in both research and in production.
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