The premium model that achieves fast, precise, and high-quality soldering operation. Offering two slim types of high performance soldering robots that letting our customers choose the best one to fit their objectives. Both come with a clean cut feed
Supplier: Shenzhen Grande Electronic Layers: 4 Application: Weighing Scales PCB Assembly - Fast Electronic Prototype PCB:FR-4/1.6mm, 2oz finished copper Specialty: Large current, High heat, heavy components Surface Treatment:
Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
Electronics Forum | Tue Nov 04 12:58:17 EST 2008 | smt123
I have to agree with Patrick here. This image appears to show a board that is NOT HASL as there is what appears to be a copper pad in the upper portion of the image. But then again the arrow tip appears to be white and I woudl expect that to be red s
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
% total void area specification A major issue and concern with vacuum reflow is solder splatter. If the vacuum pressure is reduced too quickly solder balls can be “splashed
Technology SMD SMD 16 SMD Removal SMD Rework SMD16 SMD4300TF10 SMT SMT Rework Solder Solder Ball Solder Ball Inspection Solder Ball Inspection Camera Solder Balls Solder Bumping Solder Certification