Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Industry News | 2014-10-22 13:26:01.0
Today, Congressman Rob Woodall (R-GA-7) met with executives and employees of IPC member-companies, Hunter Technology in Lawrenceville, Ga. and Viscom in Duluth, Ga., as part of a nationwide effort to discuss with policymakers legislative and regulatory issues that affect the electronics manufacturing industry. IPC and its member companies have hosted more than a dozen Members of Congress in 2014 at a variety of locations across the country.
Industry News | 2017-02-08 17:50:47.0
KYZEN is pleased to announce that the company has entered into a sales representative agreement with Electronic Assembly Products (EAP) for the state of Florida. EAP’s Mark Hendron will be teaming up with Century Automation’s Joe Cormier to deliver outstanding service to KYZEN’s customers throughout Florida. The agreement is effective immediately.
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