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Industry Directory | Consultant / Service Provider / Manufacturer
Designer, manufacturer and assembler of quickturn protoype to high volume production of flex circuits, rigid-flex and HDI flex circuits
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Phoenix FLEX/HDI AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Phoenix FLEX/HDI, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable
Electronics Forum | Wed Apr 29 04:08:55 EDT 2020 | tomzhao2
PCB Electronics Ltd, a leading corporation focusing on one-stop service for PCB&PCBA ,has a management team of 15-year experience in EMS industry. Productivity: 2 layers to 32 layers, including HDI, flex-rigid boards etc. Application fields: C
Electronics Forum | Mon Oct 29 05:14:18 EDT 2018 | vipcircuit
This is Joe from Shenzhen Vip Circuit Co,. Ltd.-- a leading PCB and PCBA manufacturer in China. Why choose Vipcircuit ? 1. PCB fabrication with 100% ET and AOI testing,certified by ISO, UL; 2. Special material like Rogers,Arlon,Taconic,Aluminum base;
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2001-02-13 08:23:07.0
IPC has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections. This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.
Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, April 20, 2017, Subscribers: 30,402, Companies: 10,575, Users: 23,153 High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_PCED.pdf
capture, signal constraints, component placement, routing, flex, HDI, documentation, signal integrity application, and post processing
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/3-rising-pcb-assembly-trends-in-2021/
. That’s where High-Density Interconnect (HDI) comes in. HDI PCBs will enable boards to have more wiring in one area. This is the key to keeping up with the rise of IoT
