New SMT Equipment: head-in-pillow (10)

3D Digital Tomosynthesis

New Equipment | Inspection

Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm.  We now have 3 years of experience using X-Plane.  It is a very powerful tool for detecting head-in-pillow (HiP) de


NC520 Lead-Free & Tin-Lead Solder Paste

NC520 Lead-Free & Tin-Lead Solder Paste

New Equipment | Solder Materials

For Use with Demanding High Density Electronic Assemblies. NC520 is a general no clean paste for use with lead-free and tin/lead alloys . NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding.  Reduced Head-

AIM Solder

Electronics Forum: head-in-pillow (14)

BGA Head-in-pillow Defects

Electronics Forum | Mon Aug 25 06:43:37 EDT 2008 | callckq

Dear All, Recently, we found a strange defect called "Head-in-pillow" defect at CPU socket BGA. The strange thing here is that this problem only appear on that CPU socket BGA and not on the others BGA which were also mounted on the PCB. We suspect

BGA drop off from the boards

Electronics Forum | Fri May 23 11:14:15 EDT 2014 | rboguski

Agree with previous comment regarding possible head-in-pillow. Use 3D x-ray or CT-scan to verify.

Industry News: head-in-pillow (94)

SMTA International Tackles Head-in-Pillow Defects

Industry News | 2011-08-17 12:59:10.0

The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

SMTA China Presents Seven Best-Paper Awards at SMTA China South 2009 Conference

Industry News | 2009-09-03 12:06:15.0

SMTA China announces that it presented awards for seven papers at the SMTA China South 2009 Conference Award Presentation Ceremony, held on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

Technical Library: head-in-pillow (12)

Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly

Technical Library | 2013-12-27 10:39:21.0

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.

Indium Corporation


Technical Library | 2020-07-02 01:14:44.0

Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.

Cookson Electronics

Videos: head-in-pillow (3)




The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component

MatriX Technologies GmbH

X3 Inline X-ray inspection system for 3D & Transmission.

X3 Inline X-ray inspection system for 3D & Transmission.


The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo

MatriX Technologies GmbH

Events Calendar: head-in-pillow (1)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

Express Newsletter: head-in-pillow (12)

SMTnet Express - December 27, 2013

SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing

SMTnet Express - July 6, 2017

SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University

Partner Websites: head-in-pillow (118704)

Explorer™ one

ASYMTEK Products | Nordson Electronics Solutions |

. Die Inspektion von Leiterplatten von allen Seiten ist wichtig, um Head-in-Pillow-Defekte zu erkennen, Bauteilrisse zu beobachten und den PTH

ASYMTEK Products | Nordson Electronics Solutions

Download Webinars/Webtorials On-Demand

Surface Mount Technology Association (SMTA) |

  Jennie Hwang, Ph.D.  $200.00 2014  Head in Pillow Causes & Process Solutions   Bob Willis  $200.00 2014  Properties and Applications of Low Temperature Solders   Ning-Cheng Lee, Ph.D.  $200.00 2013

Surface Mount Technology Association (SMTA)

head-in-pillow searches for Companies, Equipment, Machines, Suppliers & Information

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