Industry Directory | Equipment Dealer / Broker / Auctions
We are a global electronics manufacturing Solutions provider ....Our company supplies new and used SMT equipment, spare parts, consumibles, ESD supplies and services to a wide range of EMS companies.
Industry Directory | Design / Drilling / Routing / Manufacturer of Test Equipment
Test Head Engineering designs/builds test fixtures for Functional Test (FCT) and In-Circuit Test (ICT) of PCB assemblies. We build custom jigs, component burn-in trays, cable end testers, and clamp-on fixtures for production test.
The DV-8000 series Heli-Flow® pumps are the newest generation of encoded auger pumps. The pump has a fixed-head design for luer needle applications. The DV-8000 pump's rigid head and fluid path can withstand high pressures generated by thick fluids a
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Tue Oct 21 04:45:13 EDT 2008 | stanyserrao
Head 1 is not placing the parts in production. Same component is placed by head 2. Head 1 camera is camera 12 type and head 2 camera is type 8. Machine re-set done resent proper data and interchanged cameara still same problem was foundd in head 1.
Electronics Forum | Tue Feb 18 14:37:41 EST 2020 | bk
What type of head do you have on your machine a midas head or a zi-fi head? Regardless of which you do have I would make sure that the head is clean where to tools go into the head. Use a soft swab or something similar so you do not damage the z forc
Used SMT Equipment | Pick and Place/Feeders
This equipment is located in our upcoming STS Online Auction - February 25 - 28, 2019 S/W: 2.8.2b T5 Y Wagon Midas Head Hydra Head Agilis Compatible 14 Magazine Slots Large Tray Wagon Serial: 19120
Used SMT Equipment | General Purpose Test & Measurement
System has 6 probe heads 4 upper probe heads 2 lower probes heads Currently configured for analog testing Has SMEMA connections for loader/unloader to be attached Can be used for left to right or right to left load configuration All maintenance
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2008-11-12 18:12:27.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Modular SMT placement platform with ultimate flexibility. XPii is designed to meet your specific production requirements. It can be used in front of any other Europlacer machine to greatly boost the placement rate of the line or can be used stand alo
EUROPLACER: New ATOM Flexible AND High Speed Pick and Place Machines
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Career Center | Pusing, Malaysia | Engineering
I am interested to be a part of the organization where I can fully utilize my skills and make a significant contribution to the success of the employer and at the same time my individual growth. It is also another precious opportunity for me to explo
Career Center | Pusing, Malaysia | Engineering
I am interested to be a part of the organization where I can fully utilize my skills and make a significant contribution to the success of the employer and at the same time my individual growth. It is also another precious opportunity for me to explo
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2021-02-08
Jesus Crespo as Vice President leading Polymer Processing Systems 2021-02-08 Executive Vice President John J. Keane, Who Has Headed the PPS Business, Is Retiring WESTLAKE, OH, U.S.A., February 8, 2021
| https://www.eptac.com/webinar/understanding-what-bracketsbracketsbrackets-mean-in-j-std-001/
(not March Madness Brackets) and get you headed in a more productive direction. Topics we will be reviewing are: Understanding the meaning and use of brackets
