Industry Directory: heat and glue (3)

BLT circuit services ltd

Industry Directory | Manufacturer

Nitrogen Cast Lead Free solder Manufacturer, complete range of No Clean and No Residue fluxes Misprint Cleaning Systems completely compressed air driven low cost with no need for electrics 18x12

SUN-TEC Swiss United Technologies Co. Ltd.

Industry Directory | Distributor / Manufacturer

Electronic Manufactoring Services specialised on transparent conductive Films and on a cold pick & place process.

New SMT Equipment: heat and glue (366)

Benchtop Dispense Robots

Benchtop Dispense Robots

New Equipment | Dispensing

Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard

GPD Global

Automatic solder paste printer GKg G9+

Automatic solder paste printer GKg G9+

New Equipment | Assembly Services

G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function

KingFei SMT Tech

Electronics Forum: heat and glue (290)

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip

As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter

I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you

Used SMT Equipment: heat and glue (8)

Heller Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length

Heller Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length

Used SMT Equipment | Soldering - Reflow

The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5

Shenzhen Honreal Technology Co.,Ltd

Precision Valve and Assembly IR2000

Precision Valve and Assembly IR2000

Used SMT Equipment | Coating and Encapsulation

Reconditioned PVA IR2000 Curing Oven with Himdification, 460VAC 3 phase, L to R board flow, Pin Chain conveyr, SMEMA, 4 top and 4 bottom IR heating panels.

Assured Technical Service LLC

Industry News: heat and glue (322)

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Industry News | 2023-06-12 21:14:11.0

The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

Heller Industries Inc.

Multi-Functional System Dispense with Pick and Place

Industry News | 2016-11-07 16:28:47.0

GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.

GPD Global

Parts & Supplies: heat and glue (19)

Panasonic High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue

Panasonic High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue

Parts & Supplies | Screen Printers

High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue ZK Electronic Technology Co.,Limited becky@hysmt.cn www.smt-cn.com skype:beckysmt wechat:15323874439

ZK Electronic Technology Co., Limited

Juki  nozzle 106 used in 705 pick and place machine

Juki nozzle 106 used in 705 pick and place machine

Parts & Supplies | SMT Equipment

Juki nozzle 105 for 705 smt machine Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts impor

KingFei SMT Tech

Technical Library: heat and glue (12)

Revolutionize PCB Manufacturing with SMT Dispensing Machines

Technical Library | 2023-12-18 11:33:57.0

Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. ​In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Latent heat induced deformation of PCB substrate: Measurement and simulation

Technical Library | 2022-12-05 16:28:06.0

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Czech Technical University in Prague

Videos: heat and glue (59)

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

GPD Global: Multi-Functional System Dispense with Pick and Place

GPD Global: Multi-Functional System Dispense with Pick and Place

Videos

http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo

GPD Global

Training Courses: heat and glue (3)

Profiling and Solder Reflow Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: heat and glue (5)

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference and Exhibition

Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference and Exhibition

Surface Mount Technology Association (SMTA)

Career Center - Resumes: heat and glue (1)

Masood ur Rehman

Career Center | karachi, Sind Pakistan | Engineering,Production,Quality Control

For Research and Development Centre: --------------------------------------- -Give Recommendations regarding the functionality & operational security aspects in the ongoing projects by analyzing the detailed operations & functions of the product. -Mo

Express Newsletter: heat and glue (257)

Partner Websites: heat and glue (10463)

671226 - Heat Exchange Assy, New Style Heat Exchanger

Heller Industries Inc. | https://hellerindustries.com/parts/671226/

671226 - Heat Exchange Assy, New Style Heat Exchanger Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

Accu-Heat Oven

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_strategic_products_accuheat_oven.html

. We can skid, crate, package and ship to countries overseas by boat or airplane. Price: $4,000 USD Accu-Heat II Oven See more photos below                          Home     SMT & PCB Equipment

1st Place Machinery Inc.


heat and glue searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next