Industry Directory | Manufacturer
UV & Thermal Cure Epoxies for Adhesives, Coatings & Sealants
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Used SMT Equipment | Coating and Encapsulation
Reconditioned PVA IR2000 Curing Oven with Himdification, 460VAC 3 phase, L to R board flow, Pin Chain conveyr, SMEMA, 4 top and 4 bottom IR heating panels.
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Parts & Supplies | Coating and Encapsulation
PVA IR2000 Heating Element Ogden FP2146 6-0. Condition is used. 2925W 230/460VAC 3 Phase Power Meters good, decommissioned from a Precision Valve and Automation IR2000 Conformal Coating Curing Oven 24"x24"x1.5" As pictured Contact
Parts & Supplies | SMT Equipment
The AEC series is an ideal standard aluminum electrolytic capacitors in a broad range of consumer, industrial and automotive electronics applications requiring extend life , extended temperature range , and low profile . The ROHS-compliant series c
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | , Mississippi USA | Engineering,Production
About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities
Career Center | Singapore, Singapore | Engineering,Production
I am a result/goal-oriented engineer with 20 years of experience in Surface Mount Technology (SMT) environment, of which 7 years were heavily involved in field service and field application for Automated Optical Inspection (AOI) machines. I partici
SMTnet Express, August 9, 2018, Subscribers: 31,244, Companies: 11,011, Users: 25,072 New Phosphorus-based Curing Agents for PWB A. Piotrowski, M. Zhang, S. Levchik - ICL-IP , Y. Zilberman, Eran Gluz - IMI As a result of the continuous
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2019/08/pressurecureoven.pdf
Pressure Cure Oven (PCO) Pressure Cure Oven (PCO) System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. Other material considerations to keep in mind should be flame resistance, chemical resistance, and low smoke and ash formation. Glass epoxy resins like FR4 standard materials have proven invaluable thanks to these qualities, as well as providing electrical resistance and reduced heat dissipation
