Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
We represent Nordson EFD for precise dispensing and jetting systems for various precision electronic applications like dispensing solder paste, UV adhesives, dispensing of Heat dissipating components, SMT manufacturing systems,
Industry Directory | Manufacturer
Our main business is ODM for WiFi, 5G, and Thermal products. It is a SMT-based electronic product assembly company that enables PBA-SMT through SMT know-how For OEM & EMS
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-816SII Feature ▶The instructions are synchronized with the screen results ▶Equipped with Safety Light Curtain ▶Flip door, More convenient operation ▶Double hydraulic lever, More steady operation ▶Equipped with air switch, more
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S Feature ▶The instructions are synchronized with the screen results ▶Equipped with Safety Light Curtain ▶Flip door, More convenient operation ▶Double hydraulic lever, More steady operation ▶Equipped with air switch, more sa
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Wed Dec 17 13:04:37 EST 2003 | Bill
Thanks for the information, --We would like to replace the conveyor 'belt' rather than replace the whole conveyor. Do you know of any sources for the belting material? (ESD, heat and chemical resistant) Best Regards, Bill
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Industry News | 2015-06-01 11:53:34.0
PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.
Parts & Supplies | Pick and Place/Feeders
Retrofit kit heat dissipation location 1
Parts & Supplies | Pick and Place/Feeders
Retrofit kit heat dissipation location 4
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 1999-07-20 09:28:38.0
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment...
700 X 800 X 950mm 0.05mm Precision Hot Bar Soldering Machine Automatic Soldering Robot Equipment operation description The main parameters of the hot press equipment are temperature, time and pressure,and the three elements are controlled, and
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Ability to handle compliance issues NEBS, EMI/EMC UL and various customer requirements, required to handle first product builds, BOM's and ECO's. Duties/Functions: Taking requests for new products and coordinating new development
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
SMTnet Express, May 15, 2014, Subscribers: 22742, Members: Companies: 13878, Users: 36194 Performance of Light Emitting Diode on Surface Machined Heat Sink S. Shanmugan, D. Mutharasu, O. Zeng Yin, Universiti Sains Malaysia In the point
Imagineering, Inc. | https://www.pcbnet.com/blog/the-importance-of-thermal-management-in-pcb-manufacturing/
. Vias allow the use of thicker metal cores, using a thicker metal core with vias will dissipate more heat than not using these two techniques side by side
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/4-expert-setup-tips-1k-tim-application
. Protect the Heat Conducting Performance of Your Material Incorporating a thermal gap filler into your design means you’ve invested a significant amount of time considering the mechanical requirements, dielectric strength, package size, environmental conditions and limitations, and of course, how much heat to dissipate
