New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
Heat Sink Hot Air Reflow Oven for SMT Line ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special reflow
Heat Sink SMD Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special reflow oven/IR curing o
High Reliability Heat Sink Reflow Soldering Ovens ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special
Customized High Reliability Heat Sink Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special
Heat Sink Hot Air Customized Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special ref
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th
BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro
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