Industry News: heatsink for to-252 (Page 1 of 1)

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

TopLine® Awarded US Patent for CCGA Lead Free Solder Columns

Industry News | 2021-04-01 08:18:33.0

TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.

TopLine Dummy Components

Parvus to Unveil Military-Grade, Galvanically Isolated Power Supply for Embedded Computer Systems

Industry News | 2005-06-08 12:34:26.0

New OnPower 60-I PC/104 Power Supply to Deliver 60 Watts over Extended Temperature Range (-40 to +85C)

Parvus Corporation

Thermal Management Material Specification for LED PCB Design, Assembly & Fabrication

Industry News | 2009-08-11 10:17:35.0

Saturn Electronics Corporation, minority-owned bare printed circuit board fabrication manufacturer, announced a new webinar addressing PCB material specifications pertaining to thermal management for LED Boards

Saturn Electronics Corporation

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation

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