WE SPECIALISED IN SMT MACHINERIES AND PERIPHERAL EQUIPMENTS SERVICING, RENTAL & TRADING MACHINES
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Features & Benefits: One platform solution for any kind of production Commonality with existing equipment Linear motor drive increases reliability and reduces maintenance Wide component capability from 0402 (01005) chips to 90 x 100mm on up to 18" x
New Equipment | Assembly Services
Parameter name / model specification / type UL330 UL445 UL530 UL535 Supply voltagePower Supply： AC220V/50/60HZ Supply pressureAir Supply： 5kgf/c㎡ PCB size (mm)： 330*50~250 445*50~330 530*50~390 535*50~460 PCB direction: Left to right（ opetio
Electronics Forum | Tue Dec 04 06:16:50 EST 2001 | Andy
For conventional QFP device, what is the optimun height between lead and pad? 50 microns or 100 microns? What is the factor affecting this height?
Electronics Forum | Wed Nov 12 04:34:17 EST 2008 | kywl
Hi all, Assuming that i were to design a PCB and there are multiple components, what is the minimum spacing required to ensure that i won't have problems in my SMT process later on? Also, is there a minimum component stand-off height spec as well?
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Parts & Supplies | Pick and Place/Feeders
Product Description · * □ 32mm need to install special nozzle assembly · H15mm corresponding height · Identify the ball electrode · 107 corresponds to the maximum number
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/how-to-monitor-and-track-height-sense-data
How to Monitor and Track Height Sense Data | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/special-nozzle-185-10-3mm-height-special-nozzle-185-10-3mm-height-218715?page=211&order=name+desc
PANASONIC Special Nozzle 185# (10.3mm Height) Special Nozzle 185# (10.3mm Height) | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Special Nozzle 185# (10.3mm Height
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