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The Last Will And Testament of the BGA Void

Heller 公司 | https://hellerindustries.com.cn/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

(Figure 9). The solder paste was Alpha tin/lead solder alloy WS- 609. The components were placed using the Universal Advantis machine. Figure 9. MPM Stencil Printer The test vehicle was reflowed in a Heller 1912EXL Convection Reflow Oven. This oven had 14

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