Electronics Forum | Thu Jun 15 14:51:37 EDT 2017 | bmalhi
If machine serial tag referring to 3Ph, 208-240V then you cannot apply 3Ph, 380V. In order to use 3Ph, 380V supply you have, machine needs to be retrofitted to work with this voltage. If you apply 380V without voltage conversion, you will damage som
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Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Technical Library | 2007-08-02 13:24:23.0
This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.
. By Marc Peo and Don DeAngelo 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 300 200 100 0 Minutes (slope degree/second) C el si u s Lead-free Profile Figure 2