Technical Library: heller problem (Page 1 of 1)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

IPC Apex Expo 2020 Remarks

Technical Library | 2020-03-12 14:14:07.0

IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success

SMTnet

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

Technical Library | 2010-07-08 19:56:15.0

As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.

Radiance Technologies

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heller problem searches for Companies, Equipment, Machines, Suppliers & Information

Heller Industries Inc.
Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

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Florham Park, NJ USA

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