New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Electronics Forum | Sun Jun 26 22:56:13 EDT 2005 | vera1001
hello everyone,i have not visit smtnet.com so long,are you ok?vera http://www.hkenterprise.com/szcomfaje vera@comofaje.com
Electronics Forum | Tue Dec 18 11:57:05 EST 2007 | kingfish
I have an AP25 HiE which I am going to use solvent on a perticular job. What are the best settings for the solvent menu?
Used SMT Equipment | Screen Printers
2006 MPM UP2000-HiE Screen Printer Approx. Dimensions: 66" x 51" x 61" Item Location: Westerville, OH USA Serial: 23696
Used SMT Equipment | Screen Printers
2002 Speedline UP 2000 Hi E Screen Printer Refurbished by OEM in 2006 Serial: 21223 Features: Cognex 5000; 4 Axis Motion Control; Tactile Sensor; Pass Through Conveyor; 2D Post Print Inspection; Y Snuggers; Vacuum Stencil Wiper;
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2023-11-15 14:40:52.0
Low Starting Bids! Auction Closes Tomorrow. Over 200 lots of SMT machines, test & measurement equipment and much more. Featured items including: Yamaha i-Pulse M2 SMT Pick & Place, Assembleon Topaz-X II SMT Pick & Place, SPEA 4040 Flying Probe Tester, Agilent N5230C 50GHz Microwave Network Analyzer, [2 ]Juki KE-2050RL SMT Pick & Place, Juki KE-2060RL SMT Pick & Place, Tyco / Amp BMEP-3T Press, VTek PC250+ SMD Parts Counter, Samsung CP45FV Neo SMT Pick & Place, Speedline / MPM UP2000 HiE Screen Printer, DEK Horizon API Screen Printer & much more!
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Parts & Supplies | Pick and Place/Feeders
43366205 FORMER,RIGHT 43366213 FORMER,OUTSIDE 5MM R 43366113 FORMER,OUTSIDE 5MM L 45592528 FORMER, L STD CBD 43366203 FORMER,RIGHT STD, HI-DENS 43366103 FORMER,LEFT STD, HI-DENS 45592425 FORMER,OUT R5V12 CBD 45592526 FORMER, OUT L5V12 CBD 455
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Parts & Supplies | Pick and Place/Feeders
Adjustment Jig(Hi-Speed Head):CM402-L..KXFX037JA00 JIG , NOZZLE SHAFT CLEANING N210151617AA Adjustment Jig(Multi-Functional Head) KXFX037KA00 JIG PLATE 8mm N210005938AA NPM Head Jig JIG N210062551AB JIG N210130779AA JIG SU
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Vintage 2008/ Standard Top down camera and Hi resolution Top down camera/ 4 side angle cameras/RGB Lighting
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Jul 10 00:00:00 EDT 2017 - Wed Jul 12 00:00:00 EDT 2017 | Cambridge, United Kingdom
High Temperature Electronics Network (HiTEN) 2015
International Microelectronics Assembly and Packaging Society (IMAPS)
Events Calendar | Tue May 08 00:00:00 EDT 2018 - Tue May 08 00:00:00 EDT 2018 | Milwaukee, Wisconsin USA
Seminar Workshop – "Beyond Continuity & HiPot Measurements"
Career Center | Indianapolis area, Indiana USA | Engineering
Hi I recruit for Electronics Manufacturing and am currently searching for engineers for a top Automotive Electronics Manufactuer. SMT, Test, Quality and Program Engineers in the midwest. Any referrals or interest appreciated. John Myers
Career Center | Rockford, Illinois USA | Engineering
Prefer 2-4 years experience in establishing a production line for PCB Assembly - SMT, Thru-Hole. Client is a low-med vol/hi mix environment. Just recieved $1/2 million of new equipment that needs to be installed. Presently consolidating production op
Career Center | , | Maintenance
Specialized in Siemens equipment, and OmniExcel 7, MPM Ap25, Momentum.
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Heller Industries Inc. | https://hellerindustries.com/parts/3827/
3827 - HI TEMP FIBRE CABLE Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/43366103-former-left-std-hi-191309?page=503&order=name+asc
UNIVERSAL FORMER,LEFT STD, HI 43366103 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products FORMER,LEFT STD, HI Public Pricelist Public Pricelist FORMER,LEFT STD, HI
