Electronics Forum | Thu Apr 29 10:35:31 EDT 2004 | dougt
Start with a load cell (force sensor), you will need one that can handle the force range you will be placing. Someone please correct me on this if I'm wrong but I seem to recall that placement force runs in the range of a couple hundred grams. Chec
Electronics Forum | Tue Apr 18 19:48:08 EDT 2006 | davef
There is no standard, nor should there be [because the IPC standards should be aimed at describing results, not the path used to reach the results]. So, your printer equipment supplier recommendations are a good starting point. Your "35-46 lbs-in"
Electronics Forum | Fri Sep 07 14:09:57 EDT 2001 | aqueous
Hi Carol, Pressure requirements have changed over the past few years. In the recent past, aqueous cleaning systems relied on high flow, low pressure �flooding� techniques. 20 � 30 PSI pumped through large orifice nozzles. With ever increasing boa
Electronics Forum | Wed Sep 12 21:16:23 EDT 2001 | raton
The quip; All you can get! By the way, worthy answers above, especially Dave F getting a little tied up is good to see, he's always on the money otherwise. But seriously, watch for damage to other components. Example; thru hole's such as radial c
Electronics Forum | Wed Sep 03 07:39:19 EDT 2008 | pjc
You may not be getting enough exhaust pull, so the cooling modules over temp. Try swapping blower motors to isolate that before buying one. STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unlo
Electronics Forum | Wed Oct 02 13:59:11 EDT 2002 | davef
There are some excellent exhumation structures of high pressure and superhigh pressure metamorphic terranes in the Qinling-Dabie Mountain belt.
Electronics Forum | Mon Oct 22 13:21:12 EDT 2001 | Michael Konrad
Eric, The Kolb RB6D (and the RB5D) are not ultrasonic cleaners. They are high pressure spray cleaners. I would not recommend high pressure spray cleaners for misprinted assemblies with previously placed components (unless you don�t mind solder pas
Electronics Forum | Fri Mar 02 12:46:32 EST 2001 | billschreiber
Hi Dale, Care should be taken when using compressed air to dry a stencil. Just as high-pressure sprays can bend delicate land mass areas between fine-pitch apertures, so can high-pressure air. In addition, OSHA frowns on the use of high-pressuer a
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Tue Aug 29 10:04:50 EDT 2000 | Dave
Francois, It appears from "G's" admission in his earlier posting that his "study" was based on the evaluation of 2 pieces of equipment - one high pressure spray system and one ultrasonic system. There are other alternatives...low pressure, high volum
