Industry Directory | Distributor / Manufacturer / Other
Digvijay Metals are manufacturers, suppliers of stainless steel glass spigot, glass bracket, glass fittings, glass clamp, slotted pipe, decorative profile, gate roller wheel, stainless steel grill, ss railing manufacturers.
New Equipment | Cleaning Equipment
In-line technologies in a batch footprint. Today’s challenges for PCB manufacturers hinge on high density, increasing complexity, and miniaturization. Manufacturers who currently clean with batch-type cleaners are looking for a solution
New Equipment | Cleaning Equipment
The Aquastorm 200 Stainless Steel cleaning system with dual wash, dual chemical isolation and Torrid Zone dryer provides complete cleaning performance with fast throughput capability and optimal process flexibility. The Electrovert Aquastorm is a ve
Electronics Forum | Wed Dec 17 13:34:15 EST 2008 | jorge_quijano
Ok, thanks for the info, fortunatelly we already have our Camalot glue dispenser machine In-line with our MPM, for helping whit the high stand-off components.
Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef
KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.
Used SMT Equipment | THT Equipment
Very nice Q Corporation Lead Trimmer Cutter For Sale! See attached pictures and information below. Equipment Description •Q Corporation 2000 Series Q2G lead trimmer •Brushless DC drive for low maintenance with dynamic braking •Variable
Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2010-11-24 13:31:13.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces that it now offers Glue Dispense Nozzles for the Universal Instruments GDM line of equipment.
Parts & Supplies | Visual Inspection
We can supply you the following UNIVERSAL Feeders. Also Feeder Parts, Feeder Storage Carts / Feeder Trolley, Feeder Calibration Jig. 49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High
Parts & Supplies | Visual Inspection
We can supply you the following UNIVERSAL Feeders. Also Feeder Parts, Feeder Storage Carts / Feeder Trolley, Feeder Calibration Jig. 49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High
Technical Library | 2007-03-28 10:18:33.0
Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
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| https://www.hitachi-feeder.com/sale-10531383-universal-feeder-calibration-jig.html
0937C-0338 LATCH INNER HANDLE 0937C-0339 TAIL LOCK RETAINER 0937C-0342 TAIL MOUNT 0937A-0314 REEL PIN WITH MAGNET 88mm High Performance (Gold) Spliceable Tape Feeder 51459001/51459002 093EC-0002 RES COVER STANDOFF 093EC-0307 GEARBOX TAPE GUIDE 093EA-0303
