 (640x183).jpg)
Industry Directory | Inspection / Manufacturer of Test Equipment
MIRTEC has earned a solid reputation as one of the most Progressive and Dynamic Suppliers of Automated SMT Inspection Equipment to the Electronics Manufacturing Industry.
Industry Directory | Manufacturer of Assembly Material / Soldering
A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies
New Equipment | Solder Materials
Qualitek International, Inc. presents Ecolloy the future of high performance lead free silver free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu
New Equipment | Solder Materials
Rosin Fluxes Qualitek rosin fluxes are formulated with high quality purified Grade WW rosin conforming to LLL-R-626 in specially blended solvent systems. The choice of the proper flux formula is based on the soldering application, desired rosin perc
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist
Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A
Used SMT Equipment | Soldering - Reflow
Superior water cooling for higher lead free temps, chiller available Configuration: Edge/Mesh combo conveyor Water cooled for superior cooling, chillers available Chain oilers Dual cooling section Left to right transfer Spe
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
Industry News | 2010-03-10 15:39:10.0
March 2010 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new XPii SMT modular pick-and-place system, along with its award-winning iineo SMT platform in booth 1E03 at the upcoming NEPCON China/EMT China 2010 exhibition and conference scheduled to take place April 20-22, 2010 in Shanghai, PR China.
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Parts & Supplies | Soldering - Wave
Spray-on Fluxer Device TAF40-12V, TAF40-15PV This is an automatic spray device to apply the post-flux: It is used in order to better soldering effect when you use the Wave Soldering Device (below). You can change the amount of the post-flux qui
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it
Please join ZESTRON Academy for a comprehensive overview of pH neutral cleaning agent development coupled with performance reviews of pH neutral cleaning agents. Given the greater use of lead-free solder paste and the required higher reflow profiles,
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Thu May 28 00:00:00 EDT 2020 - Thu May 28 00:00:00 EDT 2020 | ,
Cleaning with pH Neutral Chemistry - Background, Applications, and Benefits
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Career Center | NAGERCOIL, Tamil Nadu India | 2017-06-10 13:44:05.0
Production,Quality Control
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About FREE Company Listing! Wave Solder Process Considerations & Set
| https://www.itweae.com/applications/dispensing/solder-paste
Solder Paste Dispensing ITW EAE Skip to main content Search form Search Support Center Contact Us Request Information Search Toggle navigation Home Company Overview History News and Events Locations ISO Certification Industry
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
. The act of implementing HMP solder will require soldering temperatures that are higher than standard Sn/Pb eutectic solders. Manufacturers soldering at high temperatures need to be aware of a few simple rules to prevent catastrophic component or board failures
