Industry Directory | Consultant / Service Provider / Manufacturer
Interflux USA, Inc. Mfg. and Distribution of high quality solders, fluxes and solder paste. Specialized in No-Residue soldering.
New Equipment | Solder Paste Mixers
SMT solder paste mixing equipment Mix soldering machine Solder cream Mixer Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
New Equipment | Solder Materials
Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp
Electronics Forum | Tue Aug 10 15:19:55 EDT 1999 | Earl Moon
| | | | I am having cleaning problems when processing PCB's which have | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc.
Electronics Forum | Tue Aug 10 15:47:34 EDT 1999 | John Thorup
| | | | | I am having cleaning problems when processing PCB's which have | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide mark
Industry News | 2010-07-02 16:00:34.0
In a victory for IPC members and the Canadian electronics industry, the Canadian Department of the Environment, on June 26, 2010, elected not to ban five rosin-containing substances from all products manufactured and sold in Canada.
Industry News | 2008-04-10 13:51:15.0
OSAKA, JAPAN � April 9, 2008 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present at the International Tin Conference, scheduled to take place April 14-17, 2008 at the Intercontinental Hotel in Hong Kong.
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
SMTnet Express, November 21, 2018, Subscribers: 31,479, Companies: 11,087, Users: 25,424 Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance Brook Sandy-Smith, Indium
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/solder-pot-service-cart
. - Solder pots of different solder alloys can be exchanged in less than 10 minutes. - Has capacity to carry two tin-lead, lead-free or HMP solder pots simultaneously reducing the time to exchange solder pots
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
, which accelerates fatigue failures, is therefore an important ingredient of any component-level or board-level solder joint reliability program
