New SMT Equipment: hooking two quad 4c's together (10)

GE IS200EMCSG1AA Speedtronic MARK VI

GE IS200EMCSG1AA Speedtronic MARK VI

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Power Supply IC200GBI001 GE Fanuc

Power Supply IC200GBI001 GE Fanuc

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: hooking two quad 4c's together (2)

Quad 4c LAE

Electronics Forum | Wed Apr 11 00:40:19 EDT 2012 | ngineer

I have a problem setting up the LAE on my Quad 4c. I set it up for 0805, and it seems to work, although it rejects a lot of parts, at least it places "most" of them. I tried setting up on a soic14, and could not get even one to pass. I believe I h

Does anyone care if Americans supply equipment to our industry.

Electronics Forum | Tue Mar 26 18:19:55 EST 2002 | davef

Is this revisionist history? Have you been breathing deeply, while eating corn doodles? Let me knock-down a couple of Zoloft. OK. Here�s the way I remember things � * UIC, Dynapert, and Amistar made the best PTH insertion equipment on the planet.

Technical Library: hooking two quad 4c's together (2)

Reliability Study of Bottom Terminated Components

Technical Library | 2015-07-14 13:19:10.0

Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.

Flex (Flextronics International)

How Does Surface Finish Affect Solder Paste Performance?

Technical Library | 2021-01-28 01:58:52.0

The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process. Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing. Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP). What is the overall effect of surface finish on solder paste performance? Which solder paste is best for each surface finish? It is the goal of this paper to answer these questions.

FCT ASSEMBLY, INC.

Express Newsletter: hooking two quad 4c's together (463)


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