Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
°C Temperature Range [7] Kim’s investigation utilized two different reflow profiles – typical (aka LSLP) and non-typical (aka Extreme) – to generate voids in the BGA solder joints
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
100 delegates/companies. A copy of each of the slides presented will be provided after the webinar. All webinar times shown are UK time – to check your local time in your countries click here In preparation for the event and to ensure you are equipped
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
- ray images (identified as STD SMT + VAC SMT), there is no indication of solder voiding in either component after vacuum reflow processing. Figure 7. Transmission x-ray images of a) a typical heavily voided 192CABGA after SMT assembly and b) the same
| https://www.smtfactory.com/Development-Stage-of-SMT-Pick-and-Place-Machine-id47535177.html
: www.smtfactory.com Inquire Since the birth of the pick and place machine in the early 1980s, the basic functions have not changed much, but the pick and place
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
- ray images (identified as STD SMT + VAC SMT), there is no indication of solder voiding in either component after vacuum reflow processing. Figure 7. Transmission x-ray images of a) a typical heavily voided 192CABGA after SMT assembly and b) the same
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
- ray images (identified as STD SMT + VAC SMT), there is no indication of solder voiding in either component after vacuum reflow processing. Figure 7. Transmission x-ray images of a) a typical heavily voided 192CABGA after SMT assembly and b) the same
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
I.C.T-LV733 How to solve the problem of void, there will be use vacuum reflow soldering machine. Soldering in vacuum environment can fundamentally solve the oxidation of solder in non-vacuum environment, and due to the effect of internal and external pressure difference of solder joint, the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. These formulas are suited to bridging gaps, filling holes, and soldering joints on vertical surfaces. Rapid reflow A term used to describe the heating of solder paste in under 5 seconds
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
bridging gaps, filling holes, and soldering joints on vertical surfaces. Rapid reflow A term used to describe the heating of solder paste in under 5 seconds. RMA 04D02 and RMA 07D02 rapid reflow solder pastes will not spatter when heated as quickly as 0.25
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