SMT Pick and Place Yamaha ys88 Pick and Place Machine components heights up to 25.5mm +/-30μm QFP mounting 8,400CPH Product description: SMT Pick and Place-Good Price! Good Quality! Good Service! INQUIRY SMT Pick and Place-Goo
http://www.flason-smt.com/product/SMD-Pick-and-Place-Machine.html SMD Pick and Place Machine Applicable Components: Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: SMD Pick and Place Machine FUJI
Industry News | 2019-08-21 16:55:59.0
MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/industries/lighting-and-led?page=3
Solder Paste Nordson EFD solder paste is the industry leader in Surface Mount Technology (SMT) applications. Our batch-to-batch consistency helps reduce defects and eliminate the need for rework. First
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. Aging at elevated temperature alters the structural and mechanical properties of the solder joint and leads to the coarsening of the precipitates in the bulk solder and growth of the intermetallic
