Yamaha Z LEX YSM20R All-around Modular surface mounter Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R All-around Modular surface mounter -Go
Yamaha Z LEX YSM20R All-around Modular surface mounter Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R All-around Modular su
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Industry News | 2015-06-08 16:46:35.0
ZESTRON is pleased to announce the SMTA Capital Chapter Tutorial “Enabling Implementation of Advanced Technologies” on June 9th will be held at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA, 20109.
Industry News | 2015-05-18 21:19:33.0
The SMTA Capital Chapter is pleased to announce it will welcome Denis Barbini, Universal Instruments Corporation, on June 9th to instruct a tutorial on Advanced SMT Technologies at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA 20109. The tutorial is scheduled from 9:00 am to 4:30 pm and includes lunch. The following should attend: quality engineers, failure analysis engineers, reliability engineers, procurement specialists, design engineers, process engineers, project managers. Registration is required for this learning event.
Technical Library | 2013-09-25 20:57:24.0
Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment.
Technical Library | 2018-03-21 22:44:30.0
Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled, defects can be produced, which may not become apparent until the PCBA is downstream. (...)This paper will discuss how Lean Six Sigma techniques were used to optimize the solder paste printing process. It will highlight how a cross-functional team used the structured Define, Measure, Analyze, Improve and Control (DMAIC) methodology to identify and control the critical inputs. The advantage of the Lean Six Sigma methodology is that it guides the team through the rigorous structured process so that all possible inputs are considered and the critical ones can be identified.
SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions If you don't see images, visit online version: http://www.smtnet.com/express/ SMD Naked Capacitors Technologies For Severe Application
process window, infrared heating technology in the reflow oven heating has been gradually phased out. In the lead-free solder, need to focus on the heat transfer effect. Especially for the large heat capacity of the original device, if you can not obtain a
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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