New SMT Equipment: how can you eliminate bubbles on a surface mount device after reflow (48)

Yamaha Z LEX YSM20R All-around Modular surface mounter

Yamaha Z LEX YSM20R All-around Modular surface mounter

New Equipment | Pick & Place

Yamaha Z LEX YSM20R All-around Modular surface mounter Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R All-around Modular surface mounter -Go

Flason Electronic Co.,limited

Yamaha Z LEX YSM20R All-around Modular surface mounter

Yamaha Z LEX YSM20R All-around Modular surface mounter

New Equipment | Pick & Place

Yamaha Z LEX YSM20R All-around Modular surface mounter Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R All-around Modular su

Flasonsmt Co.,ltd

Electronics Forum: how can you eliminate bubbles on a surface mount device after reflow (3)

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Industry News: how can you eliminate bubbles on a surface mount device after reflow (3)

ZESTRON to Host the SMTA Capital Chapter Tutorial Program on June 9th, 2015

Industry News | 2015-06-08 16:46:35.0

ZESTRON is pleased to announce the SMTA Capital Chapter Tutorial “Enabling Implementation of Advanced Technologies” on June 9th will be held at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA, 20109.

ZESTRON Americas

SMTA Capital Chapter Presents “Enabling Implementation of Advanced Technologies” Tutorial Program on June 9th at ZESTRON Americas

Industry News | 2015-05-18 21:19:33.0

The SMTA Capital Chapter is pleased to announce it will welcome Denis Barbini, Universal Instruments Corporation, on June 9th to instruct a tutorial on Advanced SMT Technologies at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA 20109. The tutorial is scheduled from 9:00 am to 4:30 pm and includes lunch. The following should attend: quality engineers, failure analysis engineers, reliability engineers, procurement specialists, design engineers, process engineers, project managers. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

Technical Library: how can you eliminate bubbles on a surface mount device after reflow (14)

Conformal Coating Process Characterization Considerations

Technical Library | 2013-09-25 20:57:24.0

Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment.

Nordson ASYMTEK

Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing

Technical Library | 2018-03-21 22:44:30.0

Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled, defects can be produced, which may not become apparent until the PCBA is downstream. (...)This paper will discuss how Lean Six Sigma techniques were used to optimize the solder paste printing process. It will highlight how a cross-functional team used the structured Define, Measure, Analyze, Improve and Control (DMAIC) methodology to identify and control the critical inputs. The advantage of the Lean Six Sigma methodology is that it guides the team through the rigorous structured process so that all possible inputs are considered and the critical ones can be identified.

Kimball Electronics, Inc.

Express Newsletter: how can you eliminate bubbles on a surface mount device after reflow (1065)

SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions

SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions If you don't see images, visit online version: http://www.smtnet.com/express/ SMD Naked Capacitors Technologies For Severe Application

Partner Websites: how can you eliminate bubbles on a surface mount device after reflow (24)

Lead-free processes propose new requirements-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-ETA

| http://etasmt.com/cc?ID=te_news_industry,4561&url=_print

 process window, infrared heating technology in the reflow oven heating has been gradually phased out. In the lead-free solder, need to focus on the heat transfer effect. Especially for the large heat capacity of the original device, if you can not obtain a

00600-248

Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf

. On the other hand, a shorter oven also can be used to achieve the same throughput and to conserve fac- tory floor space. No. 2 — Avoid Reflow of Double-sided PCBs

Heller 公司


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Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA)

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

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Phone: 952-920-7682

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