Electronics Forum: how to avoid dross in wavesoldering (8)

How to avoid tombstoning in 0201 components

Electronics Forum | Fri Jul 22 07:21:14 EDT 2005 | Mark

Try using Cobar`s anti-tombstone alloy.

How to avoid tombstoning in 0201 components

Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ

So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.

Industry News: how to avoid dross in wavesoldering (4)

ZESTRON to Present “Why Clean PCBs” in 2013 January Webinar

Industry News | 2013-01-07 17:13:26.0

ZESTR is pleased to announce the first installment of ZESTRON @cademy’s 2013 free-of-charge 10-part Cleaning Webinar Series titled “Why Clean PCBs.” ON,

ZESTRON Americas

KIC's Sales and Service Engineer to Present at the SMTA Technical Forum in Guadalajara

Industry News | 2011-10-25 00:16:12.0

KIC announces that Martin Lopez will discuss how to fix reflow- and wave-related defects as well as how to avoid them at the upcoming Technical Forum, hosted by the SMTA Guadalajara Chapter.

KIC Thermal

Technical Library: how to avoid dross in wavesoldering (2)

Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments

Technical Library | 2012-11-29 14:23:58.0

1000 units per day) production environment presents challenging technical, logistic and cost obstacles that are usually more complex than those encountered at the inspection (automated optical inspection) and the manufacturing process test step (in-circuit test).

SiFO Technologies

Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry

Technical Library | 2017-05-04 17:35:01.0

Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials.

CIMULEC

Express Newsletter: how to avoid dross in wavesoldering (445)

Partner Websites: how to avoid dross in wavesoldering (699)

How to Safeguard Against Counterfeit Components - EPTAC

| https://www.eptac.com/how-to-safeguard-against-counterfeit-components/

How to Safeguard Against Counterfeit Components EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes

How to Prevent Air Bubbles from Causing Piston Bounce

Nordson ASYMTEK | https://www.nordson.com/en/divisions/efd/blog/121019-how-to-prevent-air-bubbles-from-causing-piston-bounce

that’s not thawed properly high-speed dispensing of thick paste In this article, we will dive into each of these causes of piston bounce and explain how to prevent them

Nordson ASYMTEK


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