Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
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New Equipment | Soldering - Other
Features: 1.Uses special mixing & seperation design, the dross automatically feeded into inner part of mixing part. 2.Automatic separation of tin and tin ash,into the tin and tin-ash collection device. 3.Separated liquid pure tin automatically st
New Equipment | Soldering - Other
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
Electronics Forum | Mon Jul 01 20:44:17 EDT 2002 | davef
Actually, the white res were caused by the water carrier in your Lonco 23F reacting with the res from the nc flux used to solder the component in place. Comments are: * Some nc flux res are cleanable, some are not. Your supplier [Alpha?] can probab
Electronics Forum | Mon Jul 01 00:09:47 EDT 2002 | Ben
Hi all How can I clean the white residue between QFP 0.5 mil Pitch? The white residue was created from mistake adding liquild No-clean flux Lonco 23F for reworking clean board. I can clean almost of it by using EC7M cleaning solvent except between
Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
How to Maintain a Reflow Oven Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow ove
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Article Return to Front Page No-Residue Technolo
| https://www.smtfactory.com/How-to-clean-the-bottom-of-a-Full-auto-SMT-Stencil-Printer-stencil-automatically-online-id3873969.html
How to clean the bottom of a Full-auto SMT Stencil Printer stencil automatically online? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
) is compared to the “tent” or “straight ramp” pattern. While the former is suitable for solder pastes that require dwells at specific temperatures, the growth in the use of no-clean pastes demands more controlled high temperature periods lest the flux be depleted. a. b
