Industry News | 2018-10-18 08:37:41.0
How to optimize the reflow profile?
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SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 59, (#ts#)) SMT Express, Volume 3, Issue No. 6 - from SMTnet.com Volume 3, Issue No. 6 Friday, June 15, 2001 Featured
| https://www.eptac.com/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
. To make this metallurgical connection one must get the total area to be joined together with solder to at least 500F. Considering the time it takes the solder iron to heat the lead, the board and the solder it can take up to 1 to 3 seconds to do this, depending upon the total metallic mass of the solder joint to be created
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
? Figure 1 on page 110 includes the “ideal” reflow profile. It is characterized by a 2° to 4°C/sec ramp to a dwell zone of 30 to 90 sec at approximately 150
