New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Assembly Services
TI New and Original LMZ31710RVQ in Stock IC QFN42, 2021+ package LMZ31710RVQ 2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Today's Hot Deals： TMS320DM8127SCYE3H BGA RENESAS/ 18+ SI5338N-B-GM QFN TI 21+
Electronics Forum | Thu Mar 04 07:57:32 EST 1999 | John Godfrey
I need to setup an oven to run with a nitrogen atmosphere for boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in atmospe
Electronics Forum | Thu Mar 04 08:50:53 EST 1999 | Dave F
| | I need to setup an oven to run with a nitrogen atmosphere for | boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
TI New and Original LMZ31710RVQ in Stock IC QFN42, 2021+ package LMZ31710RVQ 2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Today's Hot Deals： TMS320DM8127SCYE3H BGA RENESAS/ 18+ SI5338N-B-GM QFN TI 21+
Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
referred to as the Weibull slope and is a measure of how tightly grouped the failures are. The higher the shape factor, the more uniform the reliability across the population is; if all components fail at exactly the same point the shape factor would be
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