Industry Directory: humiseal thermal cycling (16)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

New SMT Equipment: humiseal thermal cycling (282)

Vertical Curing Oven - Heller 788

Vertical Curing Oven - Heller 788

New Equipment | Curing Equipment

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Reliability Testing Services

Reliability Testing Services

New Equipment | Test Services

Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution

ACI Technologies, Inc.

Electronics Forum: humiseal thermal cycling (337)

Thermal cycling

Electronics Forum | Fri Nov 04 10:17:16 EST 2005 | Amol

i though they had a accleration factor as a relationship between ATC and actual life cycles

Thermal cycling

Electronics Forum | Fri Nov 04 08:29:13 EST 2005 | davef

There is no relationship between accelerated and actual life tests.

Used SMT Equipment: humiseal thermal cycling (4)

Manncorp BR790-HD BGA Rework Station

Manncorp BR790-HD BGA Rework Station

Used SMT Equipment | Repair/Rework

♣ IN-Like New Condition, Only Used Twice ♣ ◘ Split-Vision Optics with 1.3 Million Pixel HD Video Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.

World Equipment Source / R1 Source, Inc.

Ersa Versaflow 40.50

Ersa Versaflow 40.50

Used SMT Equipment | Soldering Equipment/Fluxes

Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB

Fix Trade BV

Industry News: humiseal thermal cycling (361)

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

Session 5 to Focus on Adhesives/Coatings at SMTA Harsh Environments Conference

Industry News | 2018-04-16 20:18:35.0

SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Parts & Supplies: humiseal thermal cycling (4)

SMTmax AE-R330A

SMTmax AE-R330A

Parts & Supplies | Soldering - Reflow

This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of

SMTmax

Fuji Cp6 Cp642 Cp643 Cp65 Filter Wph2030 Wph0903 Filter

Fuji Cp6 Cp642 Cp643 Cp65 Filter Wph2030 Wph0903 Filter

Parts & Supplies | SMT Equipment

FUJI CP6 CP642 CP643 CP65 WPH2030 WPH0903 FILTER FUJI CP6 WPA5152 Solenoid valve SPCHA7-25-12-Z3B Square cylinder WPA5152, SPCHA7-25-12-Z3B, CP6/CP643 square cylinder with valve WPA5142; WPH0870 WPH2130 WPH2120 vacuum valve pressure piece XP142

SMT PARTS SUPPLY LTD

Technical Library: humiseal thermal cycling (59)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Videos: humiseal thermal cycling (21)

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Events Calendar: humiseal thermal cycling (2)

Joint Chapter Meeting: Photonic Soldering

Events Calendar | Thu May 13 00:00:00 EDT 2021 - Thu May 13 00:00:00 EDT 2021 | ,

Joint Chapter Meeting: Photonic Soldering

Surface Mount Technology Association (SMTA)

CALCE Reliability Science Symposium - Spring 2020

Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA

CALCE Reliability Science Symposium - Spring 2020

CALCE Center for Advanced Life Cycle Engineering

Career Center - Jobs: humiseal thermal cycling (2)

SMT Field Service Engineer

Career Center | Sunnyvale, California USA | Engineering

Our client is a leading equipment supplier to electronic assemblers around the world. Responsibilities: Conduct technical analysis of product implementations, modifications and enhancements to product in accordance with specific customer specifi

Greenline Group

Electrical/Electronics Engineer II

Career Center | Charleston, South Carolina USA | Engineering,Maintenance

ELECTRICAL/ELECTRONICS ENGINEER II UEC is looking for an Electrical/Electronics II engineer who is motivated and enthusiastic about joining an engineering group which provides design and development of battery systems, power distribution systems,

UEC Electronics

Career Center - Resumes: humiseal thermal cycling (8)

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: humiseal thermal cycling (375)

Partner Websites: humiseal thermal cycling (114)

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296

. This paper presents some of the initial thermal cycling results from a major industrial consortia project established to evaluate the thermal fatigue reliability of multiple SAC-based solder alloys

Surface Mount Technology Association (SMTA)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance

Heller 公司


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