We can supply SMT machines, SMT spare parts, SMT production consumables and AI spare parts at competitive prices, like feeders, nozzles, filters, servo motors and various boards for JUKI, SAMSUNG, Panasonic.
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Electronics Forum | Wed Jan 02 09:24:00 EST 2013 | swag
Thanks for the help. Ramp soak spike but due to the density of this assembly it's more like ramp spike. Yes, leaded. I'm getting similar results with or without the carrier. (I designed the carrier like swiss cheese, full of holes and scallops on
Electronics Forum | Thu Dec 27 13:04:58 EST 2012 | dyoungquist
From the temps you list, I'm going to assume you are using leaded solder. What type of oven profile are you using: Ramp-Spike or Ramp-Soak-Spike? I think you will have better results if you use the Ramp-Soak-Spike type of oven profile. Better chan
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2012-01-17 15:18:10.0
GPD Global will be exhibiting in Booth #4321 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.
The following items are being sold in Baja Bid's upcoming online auction. Auction Dates, June 7 – 9, 2021 Preview, June 2, 2021 Auction Opening, June 7 [8:00 am EST] Auction Closes, June 9 [1:00 pm EST] Checkout, June 10 – 24 20
We support all kinds of I-Pulse Smt machines nozzle: I-Pulse M1 Nozzle I-Pulse M2 Nozzle I-Pulse M4 Nozzle I-Pulse M6 Nozzle I-Pulse M7 Nozzle I-Pulse M8 Nozzle I-Pulse FV7100 Nozzle I-Pulse 5530 Nozzle I-Pulse MT5520 Nozzle I-Pulse MT5620
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2020-10-14 14:49:14.0
In this study, the modification of an epoxy matrix with different amounts of cube-like and rod-like CaCO3 nanoparticles was investigated. The effects of variations in the morphology of CaCO3 on the mechanical properties and thermal stability of the CaCO3/epoxy composites were studied. The rod-like CaCO3/epoxy composites (EP-rod) showed a higher degradation temperature (4.5 _C) than neat epoxy. The results showed that the mechanical properties, such as the flexural strength, flexural modulus, and fracture toughness of the epoxy composites with CaCO3 were enhanced by the addition of cube-like and rod-like CaCO3 nanoparticles. Moreover, the mechanical properties of the composites were enhanced by increasing the amount of CaCO3 added but decreased when the filler content reached 2%. The fracture toughness Kic and fracture energy release rate Gic of cube-like and rod-like CaCO3/epoxy composites (0.85/0.74 MPa m1/2 and 318.7/229.5 J m
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Events Calendar | Wed Mar 03 00:00:00 EST 2021 - Wed Mar 03 00:00:00 EST 2021 | ,
Are Humidity Indicators Part of Your Supply Network?
Career Center | Irvine, California USA | Engineering,Production
SMT Machine Operator Pull parts from stock Build jobs per schedule Load SMD parts onto reel feeders Setup and operate Fuji CP-6 ship shooter Setup and operate DEC screen printer Setup and operate Fuji QP-2/ 3 SMD parts placement machine Setup and ope
Career Center | Bolingbrook, IL USA | Production
Tellabs is in need of an individual who will be responsible for working in one or more varying functions within a printed circuit board product assembly process. Duties include automatic insertion, surface mount operation and Surface Mount Technolog
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
I-Pulse M Series, M013 Nozzle, Dia: 2.5/1.2 (PN: LG0-M770G-00X) - SMT Xtra About Us Contact SMT XTRA +44 (0) 1302 247295 HOME SMT NOZZLES ASM (Siemens
: for I-pulse Label feeder model: for I-pulse M10/M20/M1/M2/M4 Specification: Parameter Minimum Maximum Label Size 2 x 2mm ( Length x Width) 2mm to customized one