Industry Directory | Consultant / Service Provider / Other
International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.
Industry Directory | Manufacturer's Representative
We sell Fuji, kme, sanyo, yamaha machine parts, feeder parts and used feeders
New Equipment | Education/Training
BEST offers customized classes for SMT, Advanced SMT, and BGA Rework classes on site at your facility or at our headquarters near Chicago, Illinois. All classes are all taught by instructors who not only know the material, but have also performed the
New Equipment | Industrial Automation
Best Price + Best Discount + Warranty 1 year + Quick Delivery CONTACT ME: 24/7 Online Service This is Tiffany Email: sales@askplc.com | Skype: +86 180-3023-5313 Fax: +86 0592-5173-279 | Mobile / Whats App: +86 180-3023-5313
Electronics Forum | Thu Dec 23 22:41:42 EST 1999 | Dave F
http://www.portable-design.com/editorial/1997/02/297view.html http://www.rfdesign.com/ http://www.smtplus.com/prfh.htm http://ibme2.ibme.utoronto.ca/~anthony/subpages/hotsite.htm http://www.smtplus.com/rfwireless.htm
Electronics Forum | Wed Apr 15 12:55:31 EDT 1998 | Matthias Mansfeld
O.K., somebody read a probably hand-written 3 as 8. Under these numbers, I can find at IBM's Patent Server the following other topics: USP 4,312,692 http://www.patents.ibm.com/details?patent_number=4312692: USP 4,314,870 http://www.patents.ibm.com
Used SMT Equipment | General Purpose Equipment
Used Orbotech VT-8000X in-line AOI. This machine uses the original IBM OS/2 operating system and AOI programming. It is in perfect functional condition but is no longer used.
L-3 Communications (merged with Harris to form L3Harris Technologies)
Used SMT Equipment | Chipshooters / Chip Mounters
Product Details: Machine type: PA 1100/04 Technology Max, Body size: 0402 to SOIC20 Max Board Dim (Lenght x width): 460/50 mm x 460/50 mm tact time: .072 seconds Components/Hr: 50,000 Operating System: IBM OS/2 Version 3.00 Software Version: 5.12
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Parts & Supplies | Pick and Place/Feeders
JUKI Mounter Board E8603716AA0 Z Y RELAY BOARD ASM Other parts: E86027800A0 I/O PWB ASM E86028020A0 MOTOR CONTROL PCB ASM. E86037000A0 MEMORY PCB A ASM E86037000B0 MEMORY PCB B ASM E86037150A0 MOTOR DRV I/F 1 PCB ASM. E86037160A0 X/S RELAY BOA
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Parts & Supplies | Pick and Place/Feeders
JUKI 2010 2020 2030 base feeder board E86027290A0 Other boards: E86027170A0 CN PWB ASM E86027210A0 AC SERVO CONTROL PWB ASM. E8602721AA0 AC SERVO CONTOROL PWB ASM. E86027250A0 POWER SUPPLY UNIT PWB ASM. E86027270A0 AC SERVO CTL CIRCUIT BOARD AS
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
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Wine Down Wednesday: Driving Innovation through Intrapreneurship
Career Center | Bedford, Texas USA | Sales/Marketing
Manage one or two multinational acconts for a major SMT/PCBA capital equipment provider. Will work out of the Atlanta Business Development Group and individually contribute to developing, managing, pioneering global sales for SMT capital lines. Thi
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
Career Center | Sunrise, Florida USA | Technical Support
local area field srevice technician fixing or replacing desktops and POlocal S's
Heller 公司 | https://hellerindustries.com.cn/bit_news/heller-industries-announces-joint-development-agreement-with-ibm-for-fluxless-mass-reflow-soldering-process-for-high-volume-manufacturing/
Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing - 电子邮件: jchen@hellerindustries.com.cn 电话: +86-21-64426180 公司 关于 新闻 事件 新设备 回流焊炉 双轨/双温度控制 固化和后端半导体 零空洞/真空炉 无助焊剂/酸性
| http://etasmt.com/te_service_content/2007-11-01/112.chtml
,IT 咨询,定制服务…… 尤其擅长在电子政务,ERP,CRM,EAI和基于IBM, Microsoft或BEA的相关产品和解决方案方面提供外包服务。 技术能力：除精通下列的先进技术外，OSPod的外包团队在工作中能够熟练地使用外语（如：英语,日语）。 操作系统： Microsoft Windows
