BEST offers customized classes for SMT, Advanced SMT, and BGA Rework classes on site at your facility or at our headquarters near Chicago, Illinois. All classes are all taught by instructors who not only know the material, but have also performed the
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Electronics Forum | Thu Dec 23 22:41:42 EST 1999 | Dave F
http://www.portable-design.com/editorial/1997/02/297view.html http://www.rfdesign.com/ http://www.smtplus.com/prfh.htm http://ibme2.ibme.utoronto.ca/~anthony/subpages/hotsite.htm http://www.smtplus.com/rfwireless.htm
Electronics Forum | Wed Apr 15 12:55:31 EDT 1998 | Matthias Mansfeld
O.K., somebody read a probably hand-written 3 as 8. Under these numbers, I can find at IBM's Patent Server the following other topics: USP 4,312,692 http://www.patents.ibm.com/details?patent_number=4312692: USP 4,314,870 http://www.patents.ibm.com
Product Details: Machine type: PA 1100/04 Technology Max, Body size: 0402 to SOIC20 Max Board Dim (Lenght x width): 460/50 mm x 460/50 mm tact time: .072 seconds Components/Hr: 50,000 Operating System: IBM OS/2 Version 3.00 Software Version: 5.12
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
SMT MACHINE GENUINE JUKI SPARE PARTS JUKI 2077 ONE WAY CLUTCH E3292760000 NHF04 JUKI Pats Specifications: Brand Name JUKI 2077 ONE WAY CLUTCH Part number NHF04 Model JUKI SMT MACHINE SPARE PARTS Ensure Test in machine confirmation Guarant
JUKI Mounter Board E8603716AA0 Z Y RELAY BOARD ASM Other parts: E86027800A0 I/O PWB ASM E86028020A0 MOTOR CONTROL PCB ASM. E86037000A0 MEMORY PCB A ASM E86037000B0 MEMORY PCB B ASM E86037150A0 MOTOR DRV I/F 1 PCB ASM. E86037160A0 X/S RELAY BOA
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
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Wine Down Wednesday: Driving Innovation through Intrapreneurship
Career Center | Bedford, Texas USA | Sales/Marketing
Manage one or two multinational acconts for a major SMT/PCBA capital equipment provider. Will work out of the Atlanta Business Development Group and individually contribute to developing, managing, pioneering global sales for SMT capital lines. Thi
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
their next generation chip packaging technologies. In entering this agreement Heller and IBM will take advantage of Heller's thermal management and equipment development expertise and IBM's wide range of experience, technology and process knowledge