Electronics Forum: ibm's (Page 1 of 10)

Re: SMT with communications manufacture

Electronics Forum | Thu Dec 23 22:41:42 EST 1999 | Dave F

http://www.portable-design.com/editorial/1997/02/297view.html http://www.rfdesign.com/ http://www.smtplus.com/prfh.htm http://ibme2.ibme.utoronto.ca/~anthony/subpages/hotsite.htm http://www.smtplus.com/rfwireless.htm

Re: READ THIS - PATENT LICENSE

Electronics Forum | Wed Apr 15 12:55:31 EDT 1998 | Matthias Mansfeld

O.K., somebody read a probably hand-written 3 as 8. Under these numbers, I can find at IBM's Patent Server the following other topics: USP 4,312,692 http://www.patents.ibm.com/details?patent_number=4312692: USP 4,314,870 http://www.patents.ibm.com

Re: READ THIS - PATENT LICENSE

Electronics Forum | Wed Apr 15 06:50:40 EDT 1998 | Matthias Mansfeld

Under these numbers, I can find at IBM's Patent Server only other topics: USP 4,812,692 http://www.patents.ibm.com/details?patent_number=4812692: "Motor" (Mitsubishi) USP 4,814,870 http://www.patents.ibm.com/details?patent_number=4814870: "Porta

CCGA Packages

Electronics Forum | Fri Mar 16 17:09:30 EDT 2007 | davef

Actel, IBM, AMD, Xilinx, Aeroflex, maybe more ...

Re: CCGA stencil design

Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson

Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil

Reliability of filled vs open vias, where is the old IBM study?

Electronics Forum | Thu Jun 15 14:14:18 EDT 2017 | pfuhrman

I have seen a few references in this forum to an old study (1980s?) by Roger Wild at IBM. But I cannot find a published report or usable reference to one. davef mentioned the SMTnet archives as a possible source, but that has also been a dead end.

Re: CCGA

Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon

| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA

Re: CCGA

Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange

| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic

Re: Cigerette Smoke Contamination of PCA's

Electronics Forum | Mon Feb 14 21:01:15 EST 2000 | Thomas Ravener

IBM, Endicott, New York did extensive research on that. There was also some information I think that was published. You may want to contact Howard Manko of Manko & Associates. He's the soldering guru and has written many books on soldering & solderab

Re: BGA REBALL

Electronics Forum | Thu Jun 29 14:29:25 EDT 2000 | Glenn Robertson

Leon - Remember for a CBGA you will need to use high-temp solder balls. IBM can supply the recommended solder paste (eutectic) volume. Glenn Robertson

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