Heller 公司 | https://hellerindustries.com.cn/bit_news/heller-industries-announces-joint-development-agreement-with-ibm-for-fluxless-mass-reflow-soldering-process-for-high-volume-manufacturing/
their next generation chip packaging technologies. In entering this agreement Heller and IBM will take advantage of Heller's thermal management and equipment development expertise and IBM's wide range of experience, technology and process knowledge
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