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Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering

Heller 公司 |

 their next generation chip packaging technologies.  In entering this agreement Heller and IBM will take advantage of Heller's thermal management and equipment development expertise and IBM's wide range of experience, technology and process knowledge

Heller 公司


ibm's searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

World Source Equipment: Used equipment sale. Hundreds of items on sale.
Reflow Oven

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.
Hot selling SMT spare parts and professional SMT machine solutions

IPC Certification Training from the comfort of your home or office
SMT feeders

High Throughput Reflow Oven
Electronic Solutions R3

MSD storage in desiccant dry canbinets