Industry News: ibm's (Page 1 of 21)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Heller opens Cleanroom in New Jersey Factory.

Industry News | 2013-09-10 17:48:54.0

We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.

Heller Industries Inc.

Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0

Industry News | 2016-06-22 15:33:28.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.

Heller Industries Inc.

Logistics Firms Grabbing More EMS Business

Industry News | 2003-02-11 08:42:41.0

To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment


Endicott Interconnect Goes to 4-Day Work Week

Industry News | 2003-01-31 08:23:54.0

To Compensate for Softer PCB Demand


Repair Services Being Outsourced by OEMs and EMS Firms

Industry News | 2003-03-06 08:43:16.0

Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.


Shipley Company Announces New Appointments for Printed Wiring Board Business in North America and Europe

Industry News | 2003-05-02 08:58:57.0

Bob Ferguson has been appointed PWB General Manager, North America.


Circuit Board Burnouts

Industry News | 2003-03-31 09:31:11.0

Electronic contract manufacturers face tough realities


MAPICS and Georgia Tech Lead Groundbreaking Advancements for Electronics Manufacturers

Industry News | 2003-03-19 08:25:45.0

Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry


Dr. Bradley McCredie to Present Keynote at 2010 International Wafer-Level Packaging Conference

Industry News | 2010-06-21 14:15:46.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine proudly announce that Bradley McCredie, Ph.D., IBM Fellow and Vice President of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference being held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College".

Surface Mount Technology Association (SMTA)

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