Electronics Forum: ibm ccga design rules (5)

Re: CCGA stencil design

Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson

Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil

Re: CCGA stencil design

Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F

Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even

Industry News: ibm ccga design rules (4)

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Keeping on top of ever-changing environmental regulations around the world and understanding how those regulations impact electronics manufacturers and their suppliers are the first steps on the long and winding road to compliance. Providing a roadmap to compliance, the IPC It’s Not Easy Being Green Symposium, May 11–12, 2011, in Boston, Mass., will give companies up-to-date information on the laws and regulations that affect every link of the electronics manufacturing supply chain, from Europe and Asia to South America and the United States.

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