Industry Directory: ic component lead times (142)

FKN Systek

Industry Directory | Manufacturer of Assembly Equipment / Antistatic / Drilling / Routing / OEM

Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.

Salescon Ltd.

Salescon Ltd.

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer

Salescon Ltd is operating for 20 years. Supplying various materials,tools machines for the electronic industry. Supplier for manufacturer companies in Hungary and CEE,providing services for SMEs and start-up businesses.

New SMT Equipment: ic component lead times (95850)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Precision Lead Former for Taped RADIAL Components (CF-9)

Precision Lead Former for Taped RADIAL Components (CF-9)

New Equipment | Lead Forming

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Electronics Forum: ic component lead times (782)

How many times can a component go through reflow oven?

Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist

Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the

Reduced component lead diameters

Electronics Forum | Wed May 03 12:26:30 EDT 2006 | patrickbruneel

This is indeed yet another proof that under impulse of the RoHS directives all norms are flushed down the drain. Bean counters are slowly but surely taking over our industry because they no longer face resistance by form of standards. Even the basic

Used SMT Equipment: ic component lead times (133)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

Industry News: ic component lead times (2165)

GPD Global To Demonstrate Automatic Fluid Dispensing Systems and Conformal Coating Equipment at IPC Apex Expo

Industry News | 2019-01-09 21:58:38.0

GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.

GPD Global

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

Parts & Supplies: ic component lead times (143)

Juki KE-2070M

Juki KE-2070M

Parts & Supplies | Pick and Place/Feeders

Type name high-speed veneer KE-2070M / KE -2070L / KE -2070E Substrate size M substrate(330 X 250mm) ○ L substrate(410 X 360mm) ○ E substrate(510 X 460mm) ○ Component height 6mm specification ○ 12Mm specification ○ 20Mm specification _ 25Mm sp

KingFei SMT Tech

Juki 40081815 Ratchet Hook SP SMT Feeder Parts Spring For JUKI Feeder

Juki 40081815 Ratchet Hook SP SMT Feeder Parts Spring For JUKI Feeder

Parts & Supplies | Component Packaging

40081815 Ratchet Hook SP SMT Feeder Parts Spring For JUKI Feeder Specifications 1. Ratchet Hook SP 2. Part No: 40081815 3. For JUKI Feeder 4. 1 year warranty 5. Lead time: in stock

KingFei SMT Tech

Technical Library: ic component lead times (13)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: ic component lead times (173)

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

http://www.gpd-global.com Talk about efficiency! Discover this Simple tooling changes that make short or long run production jobs quick and easy. GPD Global Axial precision lead formers have been industry standards since the 1980s, consistently ou

GPD Global

Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

http://www.gpd-global.com This amazing taped Radial components is capable of forming a variety of forms including flushmount, standoff, and lock-in (dependent on inserted dies). Find out more http://www.gpd-global.com/co_website/leadformers-cf9.php

GPD Global

Training Courses: ic component lead times (142)

Hand Soldering Certification - Lead & Lead-Free

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

EPTAC Corporation

Events Calendar: ic component lead times (37)

Hand Soldering & De-Soldering with Lead-Free Solder - Webinar

Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,

Hand Soldering & De-Soldering with Lead-Free Solder - Webinar

Surface Mount Technology Association (SMTA)

Advanced Micro SMT Hand Soldering

Events Calendar | Mon May 16 11:00:00 EDT 2016 - Fri May 20 11:00:00 EDT 2016 | Seattle, Washington USA

Advanced Micro SMT Hand Soldering

EPTAC Corporation

Career Center - Resumes: ic component lead times (58)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: ic component lead times (912)

Partner Websites: ic component lead times (731)

lead component inserters smt feeder-PCB magazine loader,PCB turn conveyor,pcb conformal coating mach

ASCEN Technology | https://www.ascen.ltd/Blog/machine/Componnent_preforming_cutting/952.html

lead component inserters smt feeder-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart

ASCEN Technology

Times Silverline Microwave Test Cable SLS06-NMNFG-01.50M ID_000947 (5/22): World Equipment Source

| https://www.wesource.com/test-and-measurement-equipment/times-silverline-microwave-test-cable-sls06-nmnfg-01.50m-id-000947-5/22/

Times Silverline Microwave Test Cable SLS06-NMNFG-01.50M ID_000947 (5/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159   CALL US


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MSD Dry Cabinets

Easily dispense fine pitch components with ±25µm positioning accuracy.
PCB Handling Machine with CE

IPC Certification Training from the comfort of your home or office
Fluid Dispense Pump Integration

MSD Dry Cabinets
Inline Cleaning Machine Hydro-clean Array

High Speed Precision In-Line SPI System - Mirtec MS-11
BGA and SMD Rework Stations

MIRTEC - the Global Leader in PCB INSPECTION Technology.