Industry Directory: ic lead tinning (102)

Purbest Technology Chengdu Co., Ltd.

Purbest Technology Chengdu Co., Ltd.

Industry Directory | Manufacturer

Purbest Tech is a manufacturer of professional equipment for the electronics industry. Our superior products include Lead Tinning System, Lead Forming Machine, PCBA Cleaning Machines, Super Cutting Machines and more.

FKN Systek

Industry Directory | Manufacturer of Assembly Equipment / Antistatic / Drilling / Routing / OEM

Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.

New SMT Equipment: ic lead tinning (37337)

Lead Tinning Fluxes

New Equipment | Solder Materials

Lead tinning is a process of hot solder dipping of semiconductor and other electronic components. This solder coating provides a thick non-porous surface which enables a long solderable storage life. Qualitek offers a line of fluxes for use in the le

Qualitek International, Inc.

NASA Style Lead Cleaner  SH-66 Lead Cleaner

NASA Style Lead Cleaner SH-66 Lead Cleaner

New Equipment | Rework & Repair Equipment

Use this quality tool to remove oxides, scale, grease and dirt from leads. The tinned copper braided shielding, backed by a stainless steel spring, ensures a fast and easy job. The lead cleaner meets NASA specification NP-200-4 and ensures the best w

Beau Tech

Electronics Forum: ic lead tinning (1249)

TH lead tinning process and solderability

Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman

Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili

lead free

Electronics Forum | Fri Aug 04 09:11:29 EDT 2006 | russ

Tin and clean them often.

Used SMT Equipment: ic lead tinning (46)

Technical Devices NU/ERA MP16

Technical Devices NU/ERA MP16

Used SMT Equipment | Soldering - Wave

Model Number : NU/ERA MP 16 Serial Number : 8005-1140 Manufacturer: Technical Devices Technical Devices NU/ERA MP-16 Wave Solder Machine_ID 112627 MODEL# NU/ERA MP 16 Windows W/PLC WSM Serial# 8005-1140 POWER 240VAC, 60HZ, 64ULA, INCLUDES FOAM

World Equipment Source / R1 Source, Inc.

Vitronics 6622CC Wave Solder

Vitronics 6622CC Wave Solder

Used SMT Equipment | Soldering - Wave

Model:  6622CC Vintage:  2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase

Lewis & Clark

Industry News: ic lead tinning (1049)

IC Packages and LEDS Can Be Stored in a Dry Storage Cabinet for Indefinite Floor Life

Industry News | 2017-10-24 17:22:53.0

Seika Machinery is pleased to announce that IC packages and LEDs can be stored in a dry box at five percent RH or less for indefinite floor life. Five of the McDry storage cabinets offer less than one percent RH, including: DXU-1001, MCU-201, MCU-301, MCU-401 and the DXU-580SF Feeder Storage Cabinet.

Seika Machinery, Inc.

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Parts & Supplies: ic lead tinning (60)

Juki E31407290A0 Z Slider Shaft IC ASM Original New SMT Nozzle Shaft For KE2020 Machine

Juki E31407290A0 Z Slider Shaft IC ASM Original New SMT Nozzle Shaft For KE2020 Machine

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: JUKI Machine Model: KE2020 Part Name: Z Slider Shaft IC ASM Part Number: E31407290A0 Use: For SMT Condition: Original New E31407290A0 Z Slider Shaft IC ASM Original New SMT Nozzle Shaft For KE2020 Machine D

KingFei SMT Tech

Juki Original New Juki Spare Parts FX-1R Magnet IC Scale YB ASM 40078584 1 Month Guarantee

Juki Original New Juki Spare Parts FX-1R Magnet IC Scale YB ASM 40078584 1 Month Guarantee

Parts & Supplies | Assembly Accessories

JUKI FX-1R MAGNET IC SCALE YB ASM 40078584 SMT MACHINE GENUINE PARTS JUKI Pats Specifications: Brand Name JUKI FX-1R MAGNET IC SCALE YB ASM Part number 40078584 Model JUKI MACHINE SPARE PARTS Ensure Test in machine confirmation Guarantee

KingFei SMT Tech

Technical Library: ic lead tinning (44)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Tin Whiskers: Risks with Lead Free | Part I

Technical Library | 2019-06-19 11:06:46.0

Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.

ACI Technologies, Inc.

Videos: ic lead tinning (45)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Training Courses: ic lead tinning (7)

Customizable Basic Hand Soldering

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Blackfox Training Institute, LLC

Advanced Electronics Manufacturing Processes Boot Camp (Boot Camp B)

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Events Calendar: ic lead tinning (26)

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Surface Mount Technology Association (SMTA)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: ic lead tinning (21)

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

SMT Engineer

Career Center | Cavite, Philippines | Engineering,Technical Support

I had 15 years Handling SMT Equipment.

Express Newsletter: ic lead tinning (677)

3D IC Development Needs Innovative Socket Solution

3D IC Development Needs Innovative Socket Solution 3D IC Development Needs Innovative Socket Solution Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications

3D ICs With TSVs - Design Challenges And Requirements

3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs

Partner Websites: ic lead tinning (1430)

Super Tinning-Products

| http://www.purbest-tech.com/en/prshow.asp?id=752

   Agitation motion for effective alloy removal    Automated rotation for QFP    Automatic result detection    Nitrogen protection HOME PRODUCTS Cleaning Machine for electronic assembly Component Tinning System Lead Forming

Tinning: Critical Care of Soldering Tips in a Lead Free Environment | EPTAC

| https://www.eptac.com/webinar/tinning-critical-care-of-soldering-tips-in-a-lead-free-environment/

Tinning: Critical Care of Soldering Tips in a Lead Free Environment | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes


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